Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521929 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Keng-Chu Lin +4 more | 2022-12-06 |
| 11516325 | Electronic device | Yuelong Liao, Qinghao Jin, Lupeng Yao | 2022-11-29 |
| 11444173 | Semiconductor device structure with salicide layer and method for forming the same | Hsiang-Ku Shen, Jin-Mu Yin, Tsung-Chieh Hsiao, Chia-Lin Chuang, Li-Zhen Yu +14 more | 2022-09-13 |
| 11309217 | Contact plug and method of formation | Ya-Huei Li, Li-Wei Chu, Yu-Hsiang Liao, Chih-Wei Chang, Ching-Hwanq Su | 2022-04-19 |
| 11309213 | Method for manufacturing semiconductor structure | Yu-Hsiang Liao, Ya-Huei Li, Li-Wei Chu, Chun-Wen Nieh, Chih-Wei Chang +1 more | 2022-04-19 |
| 11232945 | Conductive feature formation and structure | Cheng-Wei Chang, Min-Hsiu Hung, Chun-Chieh Wang, Yu-Ting Lin | 2022-01-25 |
| 11222818 | Formation method of semiconductor device structure with metal-semiconductor compound region | Yi-Hsiang Chao, Min-Hsiu Hung, Chun-Wen Nieh, Ya-Huei Li, Yu-Hsiang Liao +7 more | 2022-01-11 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Chien-Kuo Chang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2022-01-04 |