Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521929 | Capping layer for liner-free conductive structures | Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang, Keng-Chu Lin +4 more | 2022-12-06 |
| 11502166 | Seal material for air gaps in semiconductor devices | Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2022-11-15 |
| 11489057 | Contact structures in semiconductor devices | Hsu-Kai Chang, Jhih-Rong Huang, Yen-Tien Tung, Chia-Hung Chu, Tzer-Min Shen +2 more | 2022-11-01 |
| 11424185 | Semiconductor device and manufacturing method thereof | Cheng-Wei Chang, Chia-Hung Chu, Kao-Feng Lin, Hsu-Kai Chang, Sung-Li Wang +6 more | 2022-08-23 |
| 11393924 | Structure and formation method of semiconductor device with high contact area | Pang-Yen Tsai, Keng-Chu Lin, Sung-Li Wang, Pinyen Lin | 2022-07-19 |
| 11387138 | Integrated circuit isolation feature and method of forming the same | Chih-Tang Peng, Keng-Chu Lin, Teng-Chun Tsai | 2022-07-12 |
| 11296187 | Seal material for air gaps in semiconductor devices | Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen | 2022-04-05 |
| 11227794 | Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structure | Sung-Li Wang, Yu-Yun Peng, Fang-Wei Lee, Chia-Hung Chu, Mrunal A. Khaderbad +1 more | 2022-01-18 |
| 11217524 | Interconnect structure and manufacturing method for the same | Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang, Kai-Yi Chu +7 more | 2022-01-04 |