Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476365 | Fin field effect transistor device structure and method for forming the same | Chia-Hung Chu, Sung-Li Wang, Jung-Hao Chang, Mrunal A. Khaderbad, Keng-Chu Lin | 2022-10-18 |
| 11462471 | Middle-of-line interconnect structure and manufacturing method | Cheng-Wei Chang, Sung-Li Wang, Yi-Ying Liu, Chia-Hung Chu | 2022-10-04 |
| 11373878 | Technique for semiconductor manufacturing | Han-Yu Lin, Li-Te Lin, Tze-Chung Lin, Yi-Lun Chen, Jung-Hao Chang +4 more | 2022-06-28 |
| 11227794 | Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structure | Sung-Li Wang, Shuen-Shin Liang, Yu-Yun Peng, Chia-Hung Chu, Mrunal A. Khaderbad +1 more | 2022-01-18 |
| 11222794 | Semiconductor fabrication system embedded with effective baking module | Han-Yu Lin, Yi-Ruei Jhan, Li-Te Lin, Pinyen Lin, Tze-Chung Lin | 2022-01-11 |