Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462471 | Middle-of-line interconnect structure and manufacturing method | Cheng-Wei Chang, Sung-Li Wang, Chia-Hung Chu, Fang-Wei Lee | 2022-10-04 |
| 11424185 | Semiconductor device and manufacturing method thereof | Cheng-Wei Chang, Chia-Hung Chu, Kao-Feng Lin, Hsu-Kai Chang, Shuen-Shin Liang +6 more | 2022-08-23 |
| 11257712 | Source/drain contact formation methods and devices | Cheng-Wei Chang, Yu-Ming Huang, Ethan Tseng, Ken-Yu Chang | 2022-02-22 |