Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521929 | Capping layer for liner-free conductive structures | Shuen-Shin Liang, Chun-I Tsai, Chih-Wei Chang, Chun-Hsien Huang, Hung-Yi Huang +4 more | 2022-12-06 |
| 11489057 | Contact structures in semiconductor devices | Jhih-Rong Huang, Yen-Tien Tung, Chia-Hung Chu, Shuen-Shin Liang, Tzer-Min Shen +2 more | 2022-11-01 |
| 11424185 | Semiconductor device and manufacturing method thereof | Cheng-Wei Chang, Chia-Hung Chu, Kao-Feng Lin, Shuen-Shin Liang, Sung-Li Wang +6 more | 2022-08-23 |
| 11217524 | Interconnect structure and manufacturing method for the same | Shuen-Shin Liang, Ken-Yu Chang, Hung-Yi Huang, Chien-Kuo Chang, Chi-Hung Chuang +7 more | 2022-01-04 |