Issued Patents 2022
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532482 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng +6 more | 2022-12-20 |
| 11532725 | Method for forming sidewall spacers and semiconductor devices fabricated thereof | Kuan-Ting Pan, Kuo-Cheng Chiang, Yi-Ruei Jhan, Kuan-Lun Cheng, Chih-Hao Wang | 2022-12-20 |
| 11532625 | Semiconductor device and method of fabrication thereof | Kuo-Cheng Ching, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang | 2022-12-20 |
| 11527534 | Gap-insulated semiconductor device | Jung-Chien Cheng, Guan-Lin Chen, Kuo-Cheng Chiang, Chih-Hao Wang, Kuan-Lun Cheng | 2022-12-13 |
| 11522074 | Semiconductor device and manufacturing method thereof | Kuo-Cheng Ching, Kuan-Lun Cheng, Chih-Hao Wang, Keng-Chu Lin | 2022-12-06 |
| 11502034 | Semiconductor devices with backside power rail and methods of fabrication thereof | Lo-Heng Chang, Kuo-Cheng Chiang, Zhi-Chang Lin, Jung-Hung Chang, Shih-Cheng Chen +1 more | 2022-11-15 |
| 11502187 | Semiconductor device structure and method for forming the same | Kuo-Cheng Ching, Zhi-Chang Lin, Kuan-Ting Pan, Chih-Hao Wang | 2022-11-15 |
| 11495598 | Hybrid scheme for improved performance for P-type and N-type FinFETs | Kuo-Cheng Chiang, Ching-Wei Tsai, Kuan-Lun Cheng, Chih-Hao Wang | 2022-11-08 |
| 11462612 | Semiconductor device structure | Jung-Chien Cheng, Guan-Lin Chen, Kuo-Cheng Chiang, Chih-Hao Wang, Kuan-Lun Cheng | 2022-10-04 |
| 11456368 | Semiconductor device structure with hard mask layer over fin structure and method for forming the same | Kuo-Cheng Chiang, Kuan-Ting Pan, Huan-Chieh Su, Chih-Hao Wang | 2022-09-27 |
| 11456217 | Integrated circuits with buried interconnect conductors | Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-09-27 |
| 11450665 | Semiconductor structure with self-aligned backside power rail | Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-09-20 |
| 11444170 | Semiconductor device with backside self-aligned power rail and methods of forming the same | Chih-Chao Chou, Kuo-Cheng Chiang, Wen-Ting Lan, Chih-Hao Wang | 2022-09-13 |
| 11424242 | Structure and formation method of semiconductor device with isolation structure | Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-08-23 |
| 11424243 | Semiconductor device and manufacturing method thereof | Kuo-Cheng Ching, Chih-Hao Wang, Chih-Liang Chen | 2022-08-23 |
| 11393814 | Method for forming semiconductor device with helmet structure between two semiconductor fins | Kuo-Cheng Ching, Chih-Hao Wang | 2022-07-19 |
| 11387347 | Fin structures having varied fin heights for semiconductor device | Kuo-Cheng Chiang, Chih-Hao Wang | 2022-07-12 |
| 11387181 | Integrated circuits with backside power rails | Chih-Chao Chou, Kuo-Cheng Chiang, Wen-Ting Lan, Chih-Hao Wang | 2022-07-12 |
| 11380591 | Method for manufacturing nanostructure with various widths | Kuo-Cheng Ching, Kuan-Lun Cheng, Chih-Hao Wang | 2022-07-05 |
| 11362213 | Method for manufacturing a FinFET device with a backside power rail and a backside self-aligned via by etching an extended source trench | Kuo-Cheng Chiang, Chih-Hao Wang, Kuan-Lun Cheng | 2022-06-14 |
| 11362001 | Method for manufacturing nanostructures with various widths | Hsiao-Han Liu, Chih-Hao Wang, Kuo-Cheng Chiang, Kuan-Lun Cheng | 2022-06-14 |
| 11355601 | Semiconductor devices with backside power rail and backside self-aligned via | Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang, Cheng-Chi Chuang | 2022-06-07 |
| 11355396 | Method of forming a semiconductor structure including laterally etching semiconductor material in fin recess region and depositing metal gate therein | Kuo-Cheng Ching, Zhi-Chang Lin, Chih-Hao Wang, Kuan-Ting Pan | 2022-06-07 |
| 11349016 | Fin field effect transistor (FinFET) with a liner layer | Kuo-Cheng Ching, Kuan-Ting Pan, Chih-Hao Wang | 2022-05-31 |
| 11342325 | Integration of multiple fin structures on a single substrate | Chih-Chao Chou, Chih-Hao Wang, Kuo-Cheng Chiang, Wen-Ting Lan | 2022-05-24 |