Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532482 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Hsin-Chih Chen +6 more | 2022-12-20 |
| 11437239 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Wei-Liang Lin, Ru-Gun Liu | 2022-09-06 |
| 11222899 | Semiconductor device which includes fins and method of making same | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2022-01-11 |