Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538754 | Random cut patterning | Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2022-12-27 |
| 11532482 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Charles Chew-Yuen Young, Chin-Yuan Tseng, Hsin-Chih Chen +6 more | 2022-12-20 |
| 11508661 | Integrated circuit and method of manufacturing same | Pochun Wang, Ting-Wei Chiang, Hui-Zhong Zhuang, Jung-Chan Yang, Ru-Gun Liu +6 more | 2022-11-22 |
| 11495687 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kuo-Cheng Chiang +5 more | 2022-11-08 |
| 11470737 | Casing assembly having a configuration for blocking extraneous material | Yu-Chi Peng | 2022-10-11 |
| 11437239 | Method for forming semiconductor device structure | Shih-Ming Chang, Wei-Liang Lin, Chin-Yuan Tseng, Ru-Gun Liu | 2022-09-06 |
| 11424154 | Buried metal for FinFET device and method | Lei-Chun Chou, Chih-Liang Chen, Jiann-Tyng Tzeng, Ru-Gun Liu, Charles Chew-Yuen Young | 2022-08-23 |
| 11406050 | Floated-type shielding mechanism and circuit board module | Yung-Shun Kao, Tzu-Hsiang Huang | 2022-08-02 |
| 11342193 | Method of manufacturing semiconductor devices | Ru-Gun Liu, Wei-Liang Lin, Yung-Sung Yen, Ken-Hsien Hsieh, Chin-Hsiang Lin | 2022-05-24 |
| 11322362 | Landing metal etch process for improved overlay control | Chih-Min HSIAO, Chien-Wen Lai, Ya Hui Chang, Ru-Gun Liu | 2022-05-03 |
| 11294286 | Pattern formation method using a photo mask for manufacturing a semiconductor device | Ru-Gun Liu, Chin-Hsiang Lin, Cheng-I Huang, Chien-Wen Lai, Ken-Hsien Hsieh +2 more | 2022-04-05 |
| 11245233 | Cable concentrator and electronic device having the same | Yung-Shun Kao | 2022-02-08 |
| 11222899 | Semiconductor device which includes fins and method of making same | Chih-Liang Chen, Charles Chew-Yuen Young, Chin-Yuan Tseng, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2022-01-11 |