Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532482 | High-density semiconductor device | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng, Hsin-Chih Chen +6 more | 2022-12-20 |
| 11532751 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Kam-Tou Sio +2 more | 2022-12-20 |
| 11495687 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Chih-Ming Lai, Ching-Wei Tsai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +5 more | 2022-11-08 |
| 11424154 | Buried metal for FinFET device and method | Chih-Liang Chen, Jiann-Tyng Tzeng, Chih-Ming Lai, Ru-Gun Liu, Charles Chew-Yuen Young | 2022-08-23 |
| 11289384 | Method of manufacturing a semiconductor device and a semiconductor device | Hung-Li Chiang, Chih-Liang Chen, Tzu-Chiang Chen, I-Sheng Chen | 2022-03-29 |