Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538754 | Random cut patterning | Wei-Cheng Lin, Chih-Ming Lai, Jiann-Tyng Tzeng | 2022-12-27 |
| 11532751 | Metal rail conductors for non-planar semiconductor devices | Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Kam-Tou Sio +2 more | 2022-12-20 |
| 11515197 | Semiconductor device and method of forming the semiconductor device | Wei-Cheng Lin, Jiann-Tyng Tzeng | 2022-11-29 |
| 11482473 | Semiconductor device, and associated method and system | Chia-Tien Wu, Jiann-Tyng Tzeng | 2022-10-25 |
| 11476250 | Double rule integrated circuit layouts for a dual transmission gate | Hui-Zhong Zhuang, Jiann-Tyng Tzeng, Li-Chun Tien, Pin-Dai Sue, Wei-Cheng Lin | 2022-10-18 |
| 11374005 | Semiconductor structure and method of forming the same | Te-Hsin Chiu, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2022-06-28 |
| 11355487 | Layout designs of integrated circuits having backside routing tracks | Wei-An Lai, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2022-06-07 |
| 11328957 | Semiconductor device and manufacturing method thereof | Wei-Cheng Lin, Jiann-Tyng Tzeng | 2022-05-10 |
| 11309247 | Semiconductor device, and associated method and system | Wei-Cheng Lin, Jiann-Tyng Tzeng | 2022-04-19 |
| 11302631 | Integrated circuit cells and related methods | Te-Hsin Chiu, Jiann-Tyng Tzeng | 2022-04-12 |
| 11297733 | Removable fan flapper design | Chun Chang, Ta-Wei Chen, Yi-Huang Chiu | 2022-04-05 |
| 11296070 | Integrated circuit with backside power rail and backside interconnect | Guo-Huei Wu, Jiann-Tyng Tzeng | 2022-04-05 |
| 11257670 | Method of manufacturing a semiconductor device, and associated semiconductor device and system | Chia-Tien Wu, Jiann-Tyng Tzeng | 2022-02-22 |
| 11232248 | Routing-resource-improving method of generating layout diagram and system for same | Jiann-Tyng Tzeng, Wei-Cheng Lin, Jay Yang | 2022-01-25 |
| 11217528 | Semiconductor structure having buried power rail disposed between two fins and method of making the same | Jiann-Tyng Tzeng, Wei-Cheng Lin | 2022-01-04 |