Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488861 | Method for manufacturing an interconnect structure having a selectively formed bottom via | Po-Kuan HO | 2022-11-01 |
| 11482473 | Semiconductor device, and associated method and system | Shih-Wei Peng, Jiann-Tyng Tzeng | 2022-10-25 |
| 11387113 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2022-07-12 |
| 11264277 | Semiconductor device with spacers for self aligned vias | Pokuan Ho, Hsin-Ping Chen | 2022-03-01 |
| 11257670 | Method of manufacturing a semiconductor device, and associated semiconductor device and system | Shih-Wei Peng, Jiann-Tyng Tzeng | 2022-02-22 |
| 11257673 | Dual spacer metal patterning | Yu-Chieh Liao, Cheng-Chi Chuang, Tai-I Yang, Hsin-Ping Chen | 2022-02-22 |