Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387113 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chia-Tien Wu, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2022-07-12 |
| 11289338 | Method for improved critical dimension uniformity in a semiconductor device fabrication process | Chi-Cheng Hung, De-Fang Chen, Wei-Liang Lin, Yu-Tien Shen | 2022-03-29 |
| 11222783 | Using cumulative heat amount data to qualify hot plate used for postexposure baking | Chia-Cheng Chao, Chung-Cheng Wang | 2022-01-11 |