Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289332 | Directional processing to remove a layer or a material formed over a substrate | Shih-Chun Huang, Chin-Hsiang Lin, Chien-Wen Lai, Ru-Gun Liu, Wei-Liang Lin +3 more | 2022-03-29 |
| 11289338 | Method for improved critical dimension uniformity in a semiconductor device fabrication process | Chi-Cheng Hung, Chun-Kuang Chen, De-Fang Chen, Wei-Liang Lin | 2022-03-29 |
| 11239078 | Fine line patterning methods | Shih-Chun Huang, Chiu-Hsiang Chen, Ya-Wen Yeh, Po-Chin Chang, Chien-Wen Lai +7 more | 2022-02-01 |