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Ya-Wen Yeh

TSMC: 2 patents #1,228 of 3,577Top 35%
Overall (2022): #96,000 of 548,613Top 20%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11289332 Directional processing to remove a layer or a material formed over a substrate Shih-Chun Huang, Chin-Hsiang Lin, Chien-Wen Lai, Ru-Gun Liu, Wei-Liang Lin +3 more 2022-03-29
11239078 Fine line patterning methods Shih-Chun Huang, Chiu-Hsiang Chen, Yu-Tien Shen, Po-Chin Chang, Chien-Wen Lai +7 more 2022-02-01