Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495539 | Interconnect structure with air-gaps | Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin | 2022-11-08 |
| 11435224 | Stringed instrument resonance analysis device | Dai-Ting Chung, Chien-Hung Tu, Jen-Yu Chung | 2022-09-06 |
| 11422475 | Multi-metal fill with self-aligned patterning and dielectric with voids | Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu | 2022-08-23 |
| 11404367 | Method for forming semiconductor device with self-aligned conductive features | Wei-Chen Chu, Yung-Hsu Wu, Chung-Ju Lee | 2022-08-02 |
| 11366182 | Magnetoresistive devices and methods for forming the same | Chien-Hsun Wu, Cheng-Ping Chang, Chien-Hui Li, Yung-Hsiang Chen | 2022-06-21 |
| 11302792 | Fabrication of gate all around device | Yung-Chih Wang, Yu-Chieh Liao, Hsin-Ping Chen | 2022-04-12 |
| 11257673 | Dual spacer metal patterning | Yu-Chieh Liao, Cheng-Chi Chuang, Chia-Tien Wu, Hsin-Ping Chen | 2022-02-22 |
| 11244898 | Integrated circuit interconnect structures with air gaps | Li-Lin Su, Yung-Hsu Wu, Hsin-Ping Chen, Cheng-Chi Chuang | 2022-02-08 |
| 11239340 | Semiconductor arrangement and formation thereof | Tien-Lu Lin, Wai-Yi Lien, Chih-Hao Wang, Jiun-Peng Wu | 2022-02-01 |