Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11422475 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Yung-Hsu Wu | 2022-08-23 |
| 11251131 | Copper contact plugs with barrier layers | Ching-Hua Hsieh, Huang-Ming Chen, Hsueh Wen Tsau | 2022-02-15 |
| 11244898 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Yung-Hsu Wu, Hsin-Ping Chen, Cheng-Chi Chuang | 2022-02-08 |