Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11422475 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu | 2022-08-23 |
| 11404367 | Method for forming semiconductor device with self-aligned conductive features | Tai-I Yang, Yung-Hsu Wu, Chung-Ju Lee | 2022-08-02 |