Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532552 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Hai-Ching Chen, Jung-Hsun Tsai, Shau-Lin Shue, Tien-I Bao | 2022-12-20 |
| 11422475 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su | 2022-08-23 |
| 11404367 | Method for forming semiconductor device with self-aligned conductive features | Tai-I Yang, Wei-Chen Chu, Chung-Ju Lee | 2022-08-02 |
| 11387113 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu +4 more | 2022-07-12 |
| 11244898 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Li-Lin Su, Hsin-Ping Chen, Cheng-Chi Chuang | 2022-02-08 |