Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532552 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Hai-Ching Chen, Shau-Lin Shue, Tien-I Bao | 2022-12-20 |
JT
Jung-Hsun Tsai
Overall (2022): #384,881 of 548,613Top 75%
1
Patents 2022