Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488861 | Method for manufacturing an interconnect structure having a selectively formed bottom via | Chia-Tien Wu | 2022-11-01 |
PH
Po-Kuan HO
Overall (2022): #298,792 of 548,613Top 55%
1
Patents 2022