Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444170 | Semiconductor device with backside self-aligned power rail and methods of forming the same | Chih-Chao Chou, Kuo-Cheng Chiang, Shi Ning Ju, Chih-Hao Wang | 2022-09-13 |
| 11387181 | Integrated circuits with backside power rails | Chih-Chao Chou, Kuo-Cheng Chiang, Shi Ning Ju, Chih-Hao Wang | 2022-07-12 |
| 11342325 | Integration of multiple fin structures on a single substrate | Chih-Chao Chou, Chih-Hao Wang, Shi Ning Ju, Kuo-Cheng Chiang | 2022-05-24 |
| 11302580 | Nanosheet thickness | Kuan-Ting Pan, Shi Ning Ju, Kuo-Cheng Chiang, Chih-Hao Wang | 2022-04-12 |
| 11289606 | Capacitance reduction for back-side power rail device | Shi Ning Ju, Chih-Hao Wang, Kuo-Cheng Chiang, Kuan-Lun Cheng | 2022-03-29 |
| 11264327 | Backside power rail structure and methods of forming same | Kuo-Cheng Chiang, Shi Ning Ju, Chih-Chao Chou, Chih-Hao Wang | 2022-03-01 |
| 11257903 | Method for manufacturing semiconductor structure with hybrid nanostructures | Guan-Lin Chen, Shi Ning Ju, Kuo-Cheng Chiang, Chih-Hao Wang, Ching-Wei Tsai +1 more | 2022-02-22 |