Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11530479 | Atomic layer deposition tool and method | Chung-Ting Ko, Wan-Chen Hsieh, Ming-Fa Wu, Tai-Chun Huang, Yung-Cheng Lu +1 more | 2022-12-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11530479 | Atomic layer deposition tool and method | Chung-Ting Ko, Wan-Chen Hsieh, Ming-Fa Wu, Tai-Chun Huang, Yung-Cheng Lu +1 more | 2022-12-20 |