Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11530479 | Atomic layer deposition tool and method | Chung-Ting Ko, Wen-Ju Chen, Wan-Chen Hsieh, Tai-Chun Huang, Yung-Cheng Lu +1 more | 2022-12-20 |
| 11525185 | Vacuum systems in semiconductor fabrication facilities | Wen-Lung Ho, Huai-Tei Yang | 2022-12-13 |
| 11219115 | EUV collector contamination prevention | Tzung-Chi Fu, Chun Che Lin, Po-Chung Cheng, Huai-Tei Yang | 2022-01-04 |