Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450588 | Method for forming chip package structure with heat conductive layer | Chien-Hao Hsu, Kuo-Chin Chang, Cheng-Nan Lin, Mirng-Ji Lii | 2022-09-20 |
SC
Shin CHI
Overall (2022): #264,175 of 548,613Top 50%
1
Patents 2022