Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450588 | Method for forming chip package structure with heat conductive layer | Shin CHI, Kuo-Chin Chang, Cheng-Nan Lin, Mirng-Ji Lii | 2022-09-20 |
| 11222859 | Semiconductor device structure with bonding pad and method for forming the same | Wei-Hsiang Tu, Kuo-Chin Chang, Mirng-Ji Lii | 2022-01-11 |