Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222859 | Semiconductor device structure with bonding pad and method for forming the same | Chien-Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii | 2022-01-11 |
WT
Wei-Hsiang Tu
Overall (2022): #213,525 of 548,613Top 40%
1
Patents 2022