Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532583 | Semiconductor structure and manufacturing method thereof | Kuo-Chin Chang, Yen-Kun Lai, Mirng-Ji Lii | 2022-12-20 |
| 11393771 | Bonding structures in semiconductor packaged device and method of forming same | Hao-Chun Liu, Ching-Wen Hsiao, Mirng-Ji Lii | 2022-07-19 |
| 11335634 | Chip package structure and method for forming the same | Yu-Huan Chen, Chen-Shien Chen | 2022-05-17 |
| 11302537 | Chip package structure with conductive adhesive layer and method for forming the same | Yu-Huan Chen, Chen-Shien Chen | 2022-04-12 |
| 11244919 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Chen-Shien Chen, Mirng-Ji Lii | 2022-02-08 |