Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450628 | Package structure including a solenoid inductor laterally aside a die and method of fabricating the same | Tzu-Chun Tang, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang | 2022-09-20 |
| 11315891 | Methods of forming semiconductor packages having a die with an encapsulant | Chung-Hao Tsai, Kai-Chiang Wu, Chuei-Tang Wang, Chen-Hua Yu | 2022-04-26 |