Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE49045 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Chien-Hsun Lee | 2022-04-19 |
| 11227836 | Pad structure for enhanced bondability | Ru-Ying Huang, Yueh-Chiou Lin, Yian-Liang Kuo | 2022-01-18 |