Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227836 | Pad structure for enhanced bondability | Yung Ching Chen, Yueh-Chiou Lin, Yian-Liang Kuo | 2022-01-18 |
RH
Ru-Ying Huang
Overall (2022): #278,882 of 548,613Top 55%
1
Patents 2022