Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11457525 | Interconnect structure having conductor extending along dielectric block | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2022-09-27 |
| 11362624 | Varainductor having ground and floating planes and method of using | Yi-Hsuan Liu, Hsieh-Hung Hsieh, Chewn-Pu Jou | 2022-06-14 |
| 11258151 | Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material | Jiun Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou | 2022-02-22 |
| 11251354 | Thermocouple device | Ming-Hsien Tsai, Shang-Ying Tsai, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2022-02-15 |