Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11530130 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Kuei-Sung Chang, Chia-Hua Chu | 2022-12-20 |
| 11508608 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai +2 more | 2022-11-22 |
| 11485631 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Kuei-Sung Chang, Chia-Hua Chu | 2022-11-01 |
| 11420866 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Kuei-Sung Chang, Wei-Jhih Mao | 2022-08-23 |
| 11298697 | Method to produce chemical pattern in micro-fluidic structure | Li-Min Hung, Jung-Huei Peng, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2022-04-12 |
| 11251354 | Thermocouple device | Ming-Hsien Tsai, Fu-Lung Hsueh, Shih-Ming Yang, Jheng-Yuan Wang, Ming-De Chen | 2022-02-15 |