Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11530130 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Chia-Hua Chu, Shang-Ying Tsai | 2022-12-20 |
| 11508608 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Jiun-Rong Pai +2 more | 2022-11-22 |
| 11485631 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Chia-Hua Chu, Shang-Ying Tsai | 2022-11-01 |
| 11420866 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Shang-Ying Tsai, Wei-Jhih Mao | 2022-08-23 |
| 11279611 | Micro-electro mechanical system device containing a bump stopper and methods for forming the same | Chun-Wen Cheng, Chi-Hang Chin | 2022-03-22 |