Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11533565 | Dual back-plate and diaphragm microphone | Chia-Hua Chu, Wen-Tuan Lo | 2022-12-20 |
| 11508608 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang +2 more | 2022-11-22 |
| 11505454 | MEMS structure and manufacturing method thereof | Kang-Che HUANG, Yi-Chien Wu, Shiang-Chi Lin, Jung-Huei Peng | 2022-11-22 |
| 11498832 | Stacked semiconductor structure and method of forming the same | Chia-Hua Chu | 2022-11-15 |
| 11486854 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng | 2022-11-01 |
| 11434129 | Semiconductor structure and method for fabricating the same | Yi-Chuan Teng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Chang Liu, Shih-Wei Lin | 2022-09-06 |
| 11414763 | Manufacturing method of sensor in an internet-of-things | Ming-Ta Lei, Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen | 2022-08-16 |
| 11418887 | MEMS device with enhanced membrane structure and method of forming the same | Chun-Yin Tsai, Chia-Hua Chu | 2022-08-16 |
| 11342266 | Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer | Chia-Hua Chu | 2022-05-24 |
| 11312623 | Semiconductor structure for MEMS device | Yu-Chia Liu, Chia-Hua Chu, Jung-Huei Peng | 2022-04-26 |
| 11292712 | Method of forming semiconductor device structure | Yi-Chuan Teng, Chun-Yin Tsai, Chia-Hua Chu | 2022-04-05 |
| 11280786 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Chia-Hua Chu, Allen Timothy Chang, Ching-Ray Chen, Yi-Hsien Chang, Yi-Shao Liu +1 more | 2022-03-22 |
| 11279611 | Micro-electro mechanical system device containing a bump stopper and methods for forming the same | Chi-Hang Chin, Kuei-Sung Chang | 2022-03-22 |
| 11254564 | Semiconductor manufacturing method and structure thereof | Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin | 2022-02-22 |
| 11235969 | CMOS-MEMS integration with through-chip via process | Chia-Hua Chu, Wen Cheng Kuo, Wei-Jhih Mao | 2022-02-01 |