Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11420866 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Kuei-Sung Chang, Shang-Ying Tsai | 2022-08-23 |
| 11235969 | CMOS-MEMS integration with through-chip via process | Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo | 2022-02-01 |