Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11533565 | Dual back-plate and diaphragm microphone | Chun-Wen Cheng, Wen-Tuan Lo | 2022-12-20 |
| 11530130 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Kuei-Sung Chang, Shang-Ying Tsai | 2022-12-20 |
| 11498832 | Stacked semiconductor structure and method of forming the same | Chun-Wen Cheng | 2022-11-15 |
| 11485631 | Method of making ohmic contact on low doped bulk silicon for optical alignment | Kuei-Sung Chang, Shang-Ying Tsai | 2022-11-01 |
| 11486854 | CMOS compatible BioFET | Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chun-Ren Cheng, Chun-Wen Cheng | 2022-11-01 |
| 11414763 | Manufacturing method of sensor in an internet-of-things | Ming-Ta Lei, Hsin-Chih Chiang, Tung-Tsun Chen, Chun-Wen Cheng | 2022-08-16 |
| 11418887 | MEMS device with enhanced membrane structure and method of forming the same | Chun-Wen Cheng, Chun-Yin Tsai | 2022-08-16 |
| 11342266 | Method for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices using a flat surface above a sacrificial layer | Chun-Wen Cheng | 2022-05-24 |
| 11312623 | Semiconductor structure for MEMS device | Yu-Chia Liu, Chun-Wen Cheng, Jung-Huei Peng | 2022-04-26 |
| 11292712 | Method of forming semiconductor device structure | Yi-Chuan Teng, Chun-Yin Tsai, Chun-Wen Cheng | 2022-04-05 |
| 11280786 | Method for forming biochips and biochips with non-organic landings for improved thermal budget | Allen Timothy Chang, Ching-Ray Chen, Yi-Hsien Chang, Yi-Shao Liu, Chun-Ren Cheng +1 more | 2022-03-22 |
| 11254564 | Semiconductor manufacturing method and structure thereof | Chun-Wen Cheng, Fei-Lung Lai, Shiang-Chi Lin | 2022-02-22 |
| 11235969 | CMOS-MEMS integration with through-chip via process | Chun-Wen Cheng, Wen Cheng Kuo, Wei-Jhih Mao | 2022-02-01 |