Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11516596 | MEMS device and manufacturing method thereof | Wei-Chu Lin, Jung-Kuo Tu | 2022-11-29 |
| 11462478 | Layer for buffer semiconductor device including microelectromechnical system (MEMS) device | Ching-Kai Shen, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu | 2022-10-04 |
| 11434129 | Semiconductor structure and method for fabricating the same | Chun-Wen Cheng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Chang Liu, Shih-Wei Lin | 2022-09-06 |
| 11292712 | Method of forming semiconductor device structure | Chun-Yin Tsai, Chia-Hua Chu, Chun-Wen Cheng | 2022-04-05 |
| 11289568 | Reduction of electric field enhanced moisture penetration by metal shielding | Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Wen-Chuan Tai, Yi Heng Tsai +9 more | 2022-03-29 |
| 11274037 | Dual micro-electro mechanical system and manufacturing method thereof | Yang-Che Chen, Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng | 2022-03-15 |
| 11276670 | Semiconductor device and manufacturing method of semiconductor device | Victor Chiang Liang, Jung-Kuo Tu, Ching-Kai Shen | 2022-03-15 |