Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482461 | Semiconductor package and method for making the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2022-10-25 |
| 11450626 | Semiconductor package | Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng | 2022-09-20 |
| 11322576 | Inductive device | Wei-Yu Chou, Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2022-05-03 |
| 11274037 | Dual micro-electro mechanical system and manufacturing method thereof | Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng, Yi-Chuan Teng | 2022-03-15 |