Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11235969 | CMOS-MEMS integration with through-chip via process | Chun-Wen Cheng, Chia-Hua Chu, Wei-Jhih Mao | 2022-02-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11235969 | CMOS-MEMS integration with through-chip via process | Chun-Wen Cheng, Chia-Hua Chu, Wei-Jhih Mao | 2022-02-01 |