Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508608 | Vacuum wafer chuck for manufacturing semiconductor devices | Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai +2 more | 2022-11-22 |
| 11447054 | Method for transferring container | Yi-Tang Huang, Yuan Feng, Chia-Han Lin | 2022-09-20 |
| 11450402 | Sensing circuit and test device | Yi-Chun Lin | 2022-09-20 |