Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404361 | Method for fabricating package structure having encapsulate sensing chip | Shao-Tzu Tang, Jia-Fong Yeh, Mei-Chi Chen, Ying-Chou Tsai | 2022-08-02 |
| 11362624 | Varainductor having ground and floating planes and method of using | Hsieh-Hung Hsieh, Chewn-Pu Jou, Fu-Lung Hsueh | 2022-06-14 |
| 11293753 | Automatic laser distance calibration kit for wireless charging test system | Tun Li, Siming Pan, Dawei He, Jingdong Sun | 2022-04-05 |