Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532425 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo | 2022-12-20 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +1 more | 2022-12-06 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11410932 | Semiconductor device and method of manufacturing the same | Cheng-Chieh Hsieh, Hao-Yi Tsai | 2022-08-09 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo | 2022-03-22 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Hung-Yi Kuo | 2022-02-15 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Tsung-Yuan Yu, Cheng-Chieh Hsieh, Hung-Yi Kuo, Hao-Yi Tsai | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2022-02-08 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2022-01-18 |