Issued Patents 2022
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2022-06-07 |
| 11342295 | Electronic assembly, package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Tin-Hao Kuo | 2022-05-24 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-05-03 |
| 11309225 | Fan-out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2022-04-19 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2022-04-19 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2022-03-29 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen | 2022-03-22 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Ming Hung Tseng, Hung-Yi Kuo | 2022-03-22 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2022-02-15 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Tsung-Yuan Yu, Cheng-Chieh Hsieh, Hung-Yi Kuo, Ming Hung Tseng | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2022-02-08 |
| 11239135 | Package structure and method of manufacturing the same | Shih-Wei Chen, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2022-02-01 |