Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2022-05-24 |
| 11322479 | Semiconductor packages and manufacturing methods thereof | Zi-Jheng Liu, Hung-Jui Kuo | 2022-05-03 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chita Chuang, Chen-Shien Chen | 2022-02-08 |