Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532551 | Semiconductor package with chamfered semiconductor device | Chung-Shi Liu, Ching-Hua Hsieh, Chen-Hua Yu, Chien Ling Hwang, Sung-Yueh Wu | 2022-12-20 |
| 11233032 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2022-01-25 |