Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2022-07-19 |
| 11362038 | Photolithography alignment process for bonded wafers | Ching-I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang +2 more | 2022-06-14 |
| 11348790 | Apparatus and method for wafer bonding | Yeur-Luen Tu, Chin-Wei Liang | 2022-05-31 |
| 11233032 | Mechanisms for forming bonding structures | Hsin-Hung Liao, Chien Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2022-01-25 |