Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495532 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Hsun-Chung Kuang, Ching Ju Yang | 2022-11-08 |
| 11404484 | Image sensors with organic photodiodes and methods for forming the same | Chia-Shiung Tsai, Cheng-Yuan Tsai, Hsing-Lien Lin | 2022-08-02 |
| 11348790 | Apparatus and method for wafer bonding | Yeong-Jyh Lin, Yeur-Luen Tu | 2022-05-31 |