Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495532 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Chin-Wei Liang, Hsun-Chung Kuang | 2022-11-08 |
CY
Ching Ju Yang
Overall (2022): #492,048 of 548,613Top 90%
1
Patents 2022