Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527713 | Top electrode via with low contact resistance | Bi-Shen Lee, Hai-Dang Trinh, Tzu-Chung Tsai, Yao-Wen Chang | 2022-12-13 |
| 11495532 | Techniques to inhibit delamination from flowable gap-fill dielectric | Hsing-Lien Lin, Chin-Wei Liang, Ching Ju Yang | 2022-11-08 |
| 11430951 | Resistive memory cell with switching layer comprising one or more dopants | Fa-Shen Jiang, Cheng-Yuan Tsai, Hai-Dang Trinh, Hsing-Lien Lin, Bi-Shen Lee | 2022-08-30 |
| 11404638 | Multi-doped data storage structure configured to improve resistive memory cell performance | Bi-Shen Lee, Hai-Dang Trinh, Fa-Shen Jiang | 2022-08-02 |
| 11393833 | Ferroelectric random access memory device with seed layer | Bi-Shen Lee, Hsing-Lien Lin, Yi Yang Wei | 2022-07-19 |
| 11367623 | Structure and method to expose memory cells with different sizes | Sheng-Chau Chen, Cheng-Tai Hsiao, Cheng-Yuan Tsai, Yao-Wen Chang | 2022-06-21 |
| 11351648 | Chemical mechanical polishing apparatus, slurry, and method of using the same | Tung-He Chou | 2022-06-07 |
| 11342199 | Wafer carrier assembly | Ming-Tung Wu | 2022-05-24 |
| 11282697 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2022-03-22 |