Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367623 | Structure and method to expose memory cells with different sizes | Cheng-Tai Hsiao, Cheng-Yuan Tsai, Hsun-Chung Kuang, Yao-Wen Chang | 2022-06-21 |
| 11276587 | Wafer bonding method and apparatus with curved surfaces | Chih-Hui Huang, Chun-Han Tsao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen | 2022-03-15 |